Teknologian tutkimuskeskus VTT Oy needs an edge-handling sputtering cluster tool for 200-mm wafers for the VTT Micronova cleanroom semiconductor front end, to be delivered in Helsinki-Uusimaa over 14 months. The equipment must include a deposition chamber with four magnetron sputtering sources and be capable of wafer edge-handling, allowing wafers to be mechanically touched only at the wafer edge during transport and processing, and flipped in vacuum between processes. Tenders will be evaluated based on price (80%) and quality (20%).
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Prøv Cobrief ProOm anbudet
- Kontakt navn
- VTT Technical Research Centre of Finland Ltd
- Kontakt telefon
- +358 20722111
- Kontakt e-post
- kilpailutus@vtt.fi
- Adresse
- PL 1000, 02044 VTT
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.Hovedtrekkene i prosedyrenThe tender process is based on the open procedure applicable to contracts that exceed the EU procurement threshold.
Kvalifikasjonskrav
Tildelingskriterier
Beskrivelse
The evaluation of the tenders is described in section 'Grounds for decision'.
Beskrivelse
The evaluation of the tenders is described in section 'Grounds for decision'.
Se hele utlysningen
- Innkjøper
- Tittel
- Edge-Handling Sputtering Cluster Tool
- Tilleggskoder
- Tilleggskoder lagt til av Cobrief
- Lokasjon
- Varighet
- 14 måneder
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