Anleggsmaskiner og utstyr
Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of mechanical wafer dicing equipment for backend processing, which will be used for the separation of semiconductor wafers into individual chips. The equipment should support wafers up to 200 mm in diameter and be suitable for various semiconductor materials, ensuring precise and reproducible dicing processes using mechanical blade-based technology. The system must be compatible with ISO class 7 cleanroom requirements.
Slipp å lese og skrive alt selv, la Cobrief gjøre det for deg!
Prøv Cobrief ProOm anbudet
- Kontakt navn
- Kerstin Tobis
- Kontakt telefon
- 4930639258384
- Kontakt e-post
- kerstin.tobis@fbh-berlin.de
- Adresse
- Gustav-Kirchhoff-Straße 4, 12489 Berlin
The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026.
Kvalifikasjonskrav
Se konkurransedokumentene for kvalifikasjonskrav
Tildelingskriterier
Se konkurransedokumentene for tildelingskriterier
Se hele utlysningen
- Tittel
- Prior Information Notice – Wafer Dicing Equipment
- Hovedkode
- Tilleggskoder
- Estimert verdi
- 275 000,00 €
Ingen tilleggskoder fra innkjøper …