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Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of wafer thinning equipment for backend processing, which will be used for thinning semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN, and silicon. The equipment must enable precise thickness control and process monitoring, including in-situ measurement capabilities, and be compatible with ISO class 5 cleanroom requirements. The estimated maximum total contract value is 250,000 EUR.
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The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipment is intended to enable precise thickness control and process monitoring, including in-situ measurement capabilities. It will be installed in a cleanroom environment and must be compatible with ISO class 5 requirements. The procurement procedure is planned for 2026.
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Se hele utlysningen
- Tittel
- Prior Information Notice – Wafer Thinning Equipment
- Hovedkode
- Tilleggskoder
- Estimert verdi
- 250 000,00 €
Ingen tilleggskoder fra innkjøper …